The integration of optical components and functions into large scale PICs and the use of semiconductor manufacturing processes for them have been pioneered by Infinera, and result in significant benefits when integrated into a DWDM system. PICs enable the creation of super-channels, helping increase the DWDM line card capacity while reducing operational complexity. The Infinera integration approach, first on the DTN at 100G and then on the DTN-X at 500G, enabled significant power, space and cost savings for long haul DWDM applications. Recently this approach has been adopted by Infinera for the fast-growing metro Cloud application. The next step is to make it more applicable in metro and regional topologies via our Sliceable Photonics technology.